Circuit device and its manufacturing method

一种电路装置及其制造方法，在电路装置10的上面形成屏蔽层14。在露出导电图案11、覆盖电路元件12、金属细线16及导电图案11的绝缘性树脂13的上面形成由铜等金属构成的屏蔽层14。在通过去除绝缘性树脂13的一部分形成的通孔20上形成连接装置15，通过连接装置15电连接屏蔽层14和导电图案11B。由于形成通孔20的位置的导电图案11B是接地电位的导电图案，故可使屏蔽层层14为零电位。 A shielding layer 14 is formed onto the circuit device 10. The backface of a conductive pattern 11 is expos...

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Bibliographic Details
Main Authors SAKAMOTO NORIAKI, NAKAMURA TAKEFUMI, IGARASHI YUSUKE
Format Patent
LanguageChinese
English
Published 19.05.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
GENERATION
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:一种电路装置及其制造方法，在电路装置10的上面形成屏蔽层14。在露出导电图案11、覆盖电路元件12、金属细线16及导电图案11的绝缘性树脂13的上面形成由铜等金属构成的屏蔽层14。在通过去除绝缘性树脂13的一部分形成的通孔20上形成连接装置15，通过连接装置15电连接屏蔽层14和导电图案11B。由于形成通孔20的位置的导电图案11B是接地电位的导电图案，故可使屏蔽层层14为零电位。 A shielding layer 14 is formed onto the circuit device 10. The backface of a conductive pattern 11 is exposed, and a shielding layer 14 made of a metal, such as copper, is formed on the upper surface of an insulating resin 13 with which a circuit element 12, a fine metal wire 16, and a conductive pattern 11 are covered. A connecting means 15 is formed on a through-hole 20 formed by removing a part of the insulating resin 13. The shielding layer 14 and the conductive pattern 11B are electrically connected together through the connecting means 15. Since the conductive pattern 11B at the part where the through-hole 20 is formed is a conductive pattern serving as an ground potential, the shielding layer 14 can be set at zero potential.
Bibliography:Application Number: CN2003160335