Process for preparing chip of ink-jet head

A process for preparing the chip of ink jet head includes such steps as generating a heat barrier layer, generating a polycrystalline silicon layer, masking the resistor area of said polycrystalline silicon layer, doping the unmasked area of said polycrystalline silicon layer to form electrically co...

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Bibliographic Details
Main Authors QINYI ZHOU, FUSHAN LI, YINGLUN ZHANG
Format Patent
LanguageEnglish
Published 30.10.2002
Edition7
Subjects
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Summary:A process for preparing the chip of ink jet head includes such steps as generating a heat barrier layer, generating a polycrystalline silicon layer, masking the resistor area of said polycrystalline silicon layer, doping the unmasked area of said polycrystalline silicon layer to form electrically conductive area, and generating protective layer. As the resistor area and electrically conductive area are on a same layer, the stress collection is eliminated.
Bibliography:Application Number: CN2001112132