Process for preparing chip of ink-jet head
A process for preparing the chip of ink jet head includes such steps as generating a heat barrier layer, generating a polycrystalline silicon layer, masking the resistor area of said polycrystalline silicon layer, doping the unmasked area of said polycrystalline silicon layer to form electrically co...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
30.10.2002
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | A process for preparing the chip of ink jet head includes such steps as generating a heat barrier layer, generating a polycrystalline silicon layer, masking the resistor area of said polycrystalline silicon layer, doping the unmasked area of said polycrystalline silicon layer to form electrically conductive area, and generating protective layer. As the resistor area and electrically conductive area are on a same layer, the stress collection is eliminated. |
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Bibliography: | Application Number: CN2001112132 |