Printed circuit board assembly with improved thermal performance

A printed circuit board assembly comprises a printed circuit board and a heat sink that has two surface planes. One surface plane of the heat sink is raised, and provides a surface area for contact with the printed circuit board. The other surface plane is lower than the raised surface plane. The pr...

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Bibliographic Details
Main Author C. MATTAS
Format Patent
LanguageEnglish
Published 14.08.2002
Edition7
Subjects
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PRINTED CIRCUITS
STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR
WEAPONS
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Summary:A printed circuit board assembly comprises a printed circuit board and a heat sink that has two surface planes. One surface plane of the heat sink is raised, and provides a surface area for contact with the printed circuit board. The other surface plane is lower than the raised surface plane. The printed circuit board extends over the lower surface plane. The distance between the raised surface plane and the lower surface plane provides space for through-hole pins that extend beneath the printed circuit board, because the underside of the printed circuit board lies on the raised surface plane. The multi-plane heat sink can be formed by an extrusion process, as well as a stamping or other process that allows for more complex patterns of surfaces.
Bibliography:Application Number: CN20018000528