Fluorinated surfactants for aqueous acid etch solutions

Novel aqueous, acid etch solutions comprising a fluorinated surfactant are provided. The etch solutions are used with a wide variety of substrates, for example, in the etching of silicon oxide-containing substrates.

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Bibliographic Details
Main Author FLYNN RICHARD M.,LAMANNA WILLIAM M.,MOORE GEORGE G. I.,PARENT MICHAEL J.,QIU ZAI-MING,SAVU PATRICIAM.,ZHANG ZHONGXING
Format Patent
LanguageEnglish
Published 04.07.2007
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
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Summary:Novel aqueous, acid etch solutions comprising a fluorinated surfactant are provided. The etch solutions are used with a wide variety of substrates, for example, in the etching of silicon oxide-containing substrates.
Bibliography:Application Number: CN20038024927