Soldering tin lug forming method

The solder lug forming process includes provides one substrate with one metal layer on the surface; forming one patterned mask on the metal layer to expose partial of the metal layer; and electroplating to form solder lugs with Ag content of 1.6-3.0 wt% on the metal layer.

Saved in:
Bibliographic Details
Main Author ZHONGRONG,CHEN ZHAN
Format Patent
LanguageEnglish
Published 30.05.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The solder lug forming process includes provides one substrate with one metal layer on the surface; forming one patterned mask on the metal layer to expose partial of the metal layer; and electroplating to form solder lugs with Ag content of 1.6-3.0 wt% on the metal layer.
Bibliography:Application Number: CN200310115768