Soldering tin lug forming method
The solder lug forming process includes provides one substrate with one metal layer on the surface; forming one patterned mask on the metal layer to expose partial of the metal layer; and electroplating to form solder lugs with Ag content of 1.6-3.0 wt% on the metal layer.
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Main Author | |
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Format | Patent |
Language | English |
Published |
30.05.2007
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Subjects | |
Online Access | Get full text |
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Summary: | The solder lug forming process includes provides one substrate with one metal layer on the surface; forming one patterned mask on the metal layer to expose partial of the metal layer; and electroplating to form solder lugs with Ag content of 1.6-3.0 wt% on the metal layer. |
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Bibliography: | Application Number: CN200310115768 |