Heating device and heating method

The quantity of supply heat of heated gas is controlled so that a supply heat quantity (Q3, t4) of the heated gas when no heat treatment of solder or the like is needed is made smaller than a supply heat quantity (Q1, t3) of the heated gas when heat treatment of solder or the like is needed, reducin...

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Bibliographic Details
Main Author NONOMURA MASARU,ABE TOSHIHIRO,NAGAFUKU. NOBUYASU
Format Patent
LanguageEnglish
Published 23.05.2007
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:The quantity of supply heat of heated gas is controlled so that a supply heat quantity (Q3, t4) of the heated gas when no heat treatment of solder or the like is needed is made smaller than a supply heat quantity (Q1, t3) of the heated gas when heat treatment of solder or the like is needed, reducing consumption power when no heat treatment is needed for a board.
Bibliography:Application Number: CN19998012126