Composite heat sink semiconductor laser structure and its prepn. method

The method includes steps: polishing and cleaning rectangular surface prepared in selected material in high heat conducting and current conducting; polishing and cleaning rectangular surface prepared in selected insulating material in high heat conducting, and carrying out metallization treatment; c...

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Bibliographic Details
Main Author SHUN,WANG YAO
Format Patent
LanguageEnglish
Published 14.02.2007
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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Summary:The method includes steps: polishing and cleaning rectangular surface prepared in selected material in high heat conducting and current conducting; polishing and cleaning rectangular surface prepared in selected insulating material in high heat conducting, and carrying out metallization treatment; connecting metallization face to material in high heat conducting, and cutting the connected material along direction perpendicular to connection face to obtain needed composite heat sink; polishing and cleaning plane of section of composite heat sink; welding laser chips and sinks arranged in alternation so as to obtain the product. The structure includes (1) laser chip bar, (2) material in high heat conducting and current conducting, (3) insulating material in high heat conducting. Features are: simple, favorable consistency of heat sink and raised mechanical strength.
Bibliography:Application Number: CN200410010740