Electronic sealer with three-dimensional stack and assembling method thereof

Combining with method of columnar solder ball and through hole in module, the assembling method joints modules in upper layer and lower layer and completes electrical connection. Columnar conducting lug formed on supporting body through method of columnar solder ball. Making columnar conducting lugs...

Full description

Saved in:
Bibliographic Details
Main Author SHOULONG,LU CHEN
Format Patent
LanguageEnglish
Published 17.01.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Combining with method of columnar solder ball and through hole in module, the assembling method joints modules in upper layer and lower layer and completes electrical connection. Columnar conducting lug formed on supporting body through method of columnar solder ball. Making columnar conducting lugs pass through holes in module to assemble modules on supporting body so as to complete 3D piled encapsulation for electronic parts. The invention lowers encapsulation cost and simplifies procedure of encapsulation, is applicable to IC and microelectronics manufacturing area.
Bibliography:Application Number: CN20031023970