Method for molding a product and a mold used therein

The present invention relates to a method for molding a product and the molds used therein, wherein said method comprises the steps of heating a surface layer (16) of a mold cavity via induction heating to the temperature of 50-400 C for 0.5-20 sec, filling of molding material into the cavity and co...

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Bibliographic Details
Main Author PARK HERN-JIN
Format Patent
LanguageEnglish
Published 13.09.2006
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Summary:The present invention relates to a method for molding a product and the molds used therein, wherein said method comprises the steps of heating a surface layer (16) of a mold cavity via induction heating to the temperature of 50-400 C for 0.5-20 sec, filling of molding material into the cavity and cooling the mold by circulating a cooling fluid through a cooling line, wherein the mold comprises a surface layer (16) and an insulating layer (17) in which micro-channels (15) or micro-holes (18) are constructed.
Bibliography:Application Number: CN20028015006