Adhering tape for laser cutting

• Main Author: MARUYAMA HIROMITSU,YANO MASAZO,MORITA AKIRA
• Format: Patent
• Language: English
• Published: 29.03.2006
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WELDING; WORKING BY LASER BEAM

PURPOSE: A pressure sensitive adhesive tape for use in laser dicing is provided to be extensible and maintain linearity on extension without melting, breaking and scattering of an element when cutting and separating (dicing) a silicon wafer, a ceramic, glass and a metal with a water jet and a laser....