Adhering tape for laser cutting

PURPOSE: A pressure sensitive adhesive tape for use in laser dicing is provided to be extensible and maintain linearity on extension without melting, breaking and scattering of an element when cutting and separating (dicing) a silicon wafer, a ceramic, glass and a metal with a water jet and a laser....

Full description

Saved in:
Bibliographic Details
Main Author MARUYAMA HIROMITSU,YANO MASAZO,MORITA AKIRA
Format Patent
LanguageEnglish
Published 29.03.2006
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
WELDING
WORKING BY LASER BEAM
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A pressure sensitive adhesive tape for use in laser dicing is provided to be extensible and maintain linearity on extension without melting, breaking and scattering of an element when cutting and separating (dicing) a silicon wafer, a ceramic, glass and a metal with a water jet and a laser. CONSTITUTION: A laser is guided by a water jet. A non-radiation curable pressure sensitive adhesive layer and a radiation curable pressure sensitive adhesive layer are formed on one surface of the tape substrate. The substrate is penetrated by a jet water flow of the water jet, and the non-radiation curable pressure sensitive adhesive layer is set between the substrate and the radiation curable pressure sensitive adhesive layer.
Bibliography:Application Number: CN20021004672