一种镍铬铜应变康铜精密电阻合金极薄箔材的制备工艺

本发明公开了一种镍铬铜应变康铜精密电阻合金极薄箔材的制备工艺。一种镍铬铜应变康铜精密电阻合金极薄箔材的制备工艺，包括如下步骤：步骤一，原料准备：原料的主要化学成分，按质量百分比，Mn为1.5-2.5％，Ni为41.5-45.5％，Fe≤0.20％，Co≤0.05％，Ti≤0.10％，Mg≤0.05％，Si≤0.10％，余量为Cu；步骤二，冷轧工艺冷轧处理；步骤三，真空热处理；真空退火温度为460-580℃，保温时间为4h；步骤四，倒料；步骤五，检验；步骤六，包装出货。...

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Bibliographic Details
Format Patent
LanguageChinese
Published 12.08.2025
Subjects
ALLOYS
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS
CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL
METALLURGY
PERFORMING OPERATIONS
PUNCHING METAL
ROLLING OF METAL
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:本发明公开了一种镍铬铜应变康铜精密电阻合金极薄箔材的制备工艺。一种镍铬铜应变康铜精密电阻合金极薄箔材的制备工艺，包括如下步骤：步骤一，原料准备：原料的主要化学成分，按质量百分比，Mn为1.5-2.5％，Ni为41.5-45.5％，Fe≤0.20％，Co≤0.05％，Ti≤0.10％，Mg≤0.05％，Si≤0.10％，余量为Cu；步骤二，冷轧工艺冷轧处理；步骤三，真空热处理；真空退火温度为460-580℃，保温时间为4h；步骤四，倒料；步骤五，检验；步骤六，包装出货。
Bibliography:Application Number: CN202510572760