Semi-automatic wafer surface inspection machine and wafer inspection method

• Main Authors: XIAO YUHANG, SUN HUIMIN, ZHENG LONGJIE, CAO XIONGZHEN
• Format: Patent
• Language: Chinese; English
• Published: 30.08.2024
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention relates to the technical field of wafer inspection, and particularly discloses a semi-automatic wafer surface inspection machine and a wafer inspection method. The semi-automatic wafer surface inspection machine comprises a rack, and a straight-edge product box, a straight-edge product positioning module, a circular product box, an edge finding alignment module, a manipulator, a visual macroscopic inspection module and a visual microscopic inspection module which are mounted on the rack. The straight-edge product positioning module comprises a straight-edge product supporting mechanism, a left positioning piece and a right positioning piece. The left positioning piece and the right positioning piece are arranged on the two sides of the straight-edge product supporting mechanism. The left positioning piece and the right positioning piece are driven to get close to each other to push the product to a set position and can also be driven to get away from each other to release the product. The mechan