Platform architecture using linear vacuum transfer module to reduce footprint

• Main Authors: GOULD, RICHARD, H, BLANK RICHARD
• Format: Patent
• Language: Chinese; English
• Published: 23.08.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An atmosphere-to-vacuum (ATV) transfer module for a substrate processing tool includes a first side configured to engage with at least one loading station; the transfer manipulator assembly is arranged in the ATV transfer module; and a second side opposite the first side. The transfer robot assembly is configured to transfer a substrate between the at least one loading station and at least one loading lock disposed between an ATV transfer module and a vacuum transfer module (VTM). The second side is configured to engage with the at least one load lock. The transfer robot assembly is disposed adjacent to the second side, and the at least one load lock extends through the second side into an interior volume of the ATV transfer module. 一种用于衬底处理工具的大气至真空(ATV)传送模块包括：第一侧，其被构造成与至少一个装载站接合；传送机械手组件，其被布置在所述ATV传送模块内；以及与所述第一侧相对的第二侧。所述传送机械手组件被配置为在所述至少一个装载站和布置在ATV传送模块和真空传送模块(VTM)之间的至少一个装载锁之间传送衬底。所述第二侧被构造成与所述至少一个装载锁接合。所述传送机械手组件邻近所述第二侧布置，并且所述至少一个装载锁延伸穿过所述第二侧到达所述ATV传送模块的内部容积中。