Wiring-forming member, method for forming wiring layer using wiring-forming member, and wiring-forming member

A wiring-forming member (1) is provided with: an adhesive layer (10) containing conductive particles (12); and a metal layer (20) disposed on the adhesive layer (10). The adhesive layer (10) comprises: a first adhesive layer (15) containing conductive particles (12) and an adhesive component; and a...

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Main Authors ITO YUKA, TAKANO, NOZOMU, IZAWA HIROYUKI, KOTAKE TOMOHIKO, FUJIMOTO DAISUKE, OKOSHI MASASHI, TAKAGI SHUNSUKE, AKAI KUNIHIKO
Format Patent
LanguageChinese
English
Published 13.08.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A wiring-forming member (1) is provided with: an adhesive layer (10) containing conductive particles (12); and a metal layer (20) disposed on the adhesive layer (10). The adhesive layer (10) comprises: a first adhesive layer (15) containing conductive particles (12) and an adhesive component; and a second adhesive layer (16) containing an adhesive component. 配线形成用部件(1)具备：黏合剂层(10)，含有导电性粒子(12)；及金属层(20)，配置于黏合剂层(10)上。黏合剂层(10)包括：第1黏合剂层(15)，含有导电性粒子(12)和黏合剂成分；及第2黏合剂层(16)，含有黏合剂成分。
Bibliography:Application Number: CN20228087280