Semiconductor test structure and test method thereof

The invention provides a semiconductor test structure and a test method thereof, a first enclosure wall structure of the semiconductor test structure surrounds the outer side of a second bonding pad structure in an insulating manner, a second enclosure wall structure surrounds the outer side of a th...

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Bibliographic Details
Main Authors HUANG BIAOZI, SONG JIAHUA
Format Patent
LanguageChinese
English
Published 26.07.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:The invention provides a semiconductor test structure and a test method thereof, a first enclosure wall structure of the semiconductor test structure surrounds the outer side of a second bonding pad structure in an insulating manner, a second enclosure wall structure surrounds the outer side of a third bonding pad structure in an insulating manner, and the second bonding pad structure and the third bonding pad structure are electrically connected through a capacitor. The first bonding pad structure is electrically connected with the first enclosing wall structure, the first enclosing wall structure is electrically connected with the third bonding pad structure through the first resistor, the second enclosing wall structure is electrically connected with the fourth bonding pad structure, and the second enclosing wall structure is electrically connected with the second bonding pad structure through the second resistor; during TDDB testing, one of the second bonding pad structure and the third bonding pad struct
Bibliography:Application Number: CN202410764741