Filler for electronic material, method for producing same, slurry for electronic material, and resin composition for electronic material

• Main Authors: WATANABE YUSUKE, OGATA KOHEI, TOMITA NOBUTAKA
• Format: Patent
• Language: Chinese; English
• Published: 23.07.2024
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOUNDS THEREOF; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INORGANIC CHEMISTRY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-METALLIC ELEMENTS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PREPARATION OF CARBON BLACK; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention addresses the problem of providing a filler for electronic materials having excellent electrical characteristics. The filler for electronic materials according to the present invention comprises a silica particle material produced by a dry method, and has a D50 of 0.2 [mu] m to 7.0 [mu] m. Further, the filler for electronic materials according to the present invention has a ratio of (BET specific surface area)/(theoretical specific surface area calculated from D50) of 0.85-1.2 (requirement 1) and/or a ratio of D10/D50 of 0.55-0.75 (requirement 2). Electrical characteristics such as a Df value can be improved by satisfying at least one of requirements 1 and 2. Here, the BET specific surface area is a value measured using nitrogen, and D50 is a 50 mass% cumulative diameter, i.e., a median diameter, which means that the particle diameter reaches 50 mass% when the particle masses are sequentially accumulated from the small particle diameter side. Likewise, D10 is 10 mass% cumulative diameter