Clamping structure for plating

The invention relates to the technical field of electroplating equipment, in particular to a clamping structure for plating, which comprises a support and a clamping frame, when the clamping frame rotates around the support, one energy consumption unit firstly begins to participate in energy consump...

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Bibliographic Details
Main Authors LI XINZHONG, LUO GUANGYIN, LIU GANG
Format Patent
LanguageChinese
English
Published 23.07.2024
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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