Clamping structure for plating

• Main Authors: LI XINZHONG, LUO GUANGYIN, LIU GANG
• Format: Patent
• Language: Chinese; English
• Published: 23.07.2024
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention relates to the technical field of electroplating equipment, in particular to a clamping structure for plating, which comprises a support and a clamping frame, when the clamping frame rotates around the support, one energy consumption unit firstly begins to participate in energy consumption, along with deflection of the clamping frame on the support, thrust of flowing electroplating liquid to a metal plate is changed, and the metal plate is subjected to energy consumption. If the flowing electroplating liquid is not enough to continuously push the metal plate to enable the clamping frame to rotate around the bracket, the clamping frame is kept in a stable state in the bracket; if the flowing electroplating liquid can continue to push the metal plate to enable the clamping frame to rotate around the support, the energy consumption unit does not participate in energy consumption at the moment, and the adjacent energy consumption unit begins to participate in energy consumption until the clamping fr