High-precision micro-nano electronic component laser etching processing equipment

• Main Author: YAN PEIQIANG
• Format: Patent
• Language: Chinese; English
• Published: 19.07.2024
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses high-precision micro-nano electronic component laser etching processing equipment which comprises an operation table, a linear module fixedly installed at one end of the operation table, a laser etcher whole fixedly installed at one end of a movable block of the linear module, a cross sliding table fixedly installed on the upper surface of the operation table, a laser emitting end face of the laser etcher whole and a laser emitting end face of the cross sliding table, a placing plate is fixedly installed on the upper surface of an X-direction sliding table in the cross-shaped sliding table, an electronic element can be placed on the upper surface of the placing plate, the placing plate can be flush with the whole laser etching device, a mounting groove is formed in one end of the operation table, and a gas filtering assembly is detachably installed in the mounting groove; and the gas suction end of the gas filtering assembly is fixedly mounted on the upper surface of the placement plat