Process method for improving coating adhesive force of conformal coating
The invention relates to the technical field of circuit board coating, and discloses a process method for improving the coating adhesive force of conformal coating, which comprises the following steps: acquiring the surface energy value of a substrate and the surface tension of the coating; the wett...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
19.07.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to the technical field of circuit board coating, and discloses a process method for improving the coating adhesive force of conformal coating, which comprises the following steps: acquiring the surface energy value of a substrate and the surface tension of the coating; the wettability between the substrate and the coating is judged, and if the surface energy value of the substrate is higher than the surface tension of the coating, the substrate and the coating have good wettability; on the contrary, the wettability between the coating and the substrate is poor; if the wettability between the coating and the substrate is poor or is not wetted, the wettability between the coating and the substrate is improved by increasing the surface energy value of the substrate. By comparing the surface energy value of the substrate with the surface tension of the coating, whether the substrate and the coating have good wettability or not can be known, so that the coating adhesion effect of the coating |
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Bibliography: | Application Number: CN202410510397 |