Process for combining thin film and aluminum oxide ceramic substrate
The invention provides a process for combining a thin film and an aluminum oxide ceramic substrate, which belongs to the technical field of thick thin film combination and comprises the following steps: preparing a multilayer aluminum oxide ceramic substrate; carrying out grinding and polishing trea...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.07.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a process for combining a thin film and an aluminum oxide ceramic substrate, which belongs to the technical field of thick thin film combination and comprises the following steps: preparing a multilayer aluminum oxide ceramic substrate; carrying out grinding and polishing treatment on the surface of the multi-layer aluminum oxide ceramic substrate; sputtering a metal layer on the surface of the multilayer aluminum oxide ceramic substrate; and performing photoetching and plating on the metal layer for multiple times to form a thin film structure. According to the technology for combining the thin film and the aluminum oxide ceramic substrate, the multi-layer aluminum oxide ceramic substrate is combined with the metal layer sputtered on the surface of the aluminum oxide ceramic substrate to form a thick film and thin film combined structure, and the defects of the multi-layer aluminum oxide ceramic substrate are made up through the characteristics of the thin film. The thin film and alumi |
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Bibliography: | Application Number: CN202410448097 |