Polyamic acid, polyimide film, multilayer film using same, flexible metal foil laminate, and electronic component

• Main Authors: BACK SUNG YUL, LEE KIL NAM, CHO MIN-SANG, CHAE SOO-KYUNG
• Format: Patent
• Language: Chinese; English
• Published: 12.07.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

The present invention provides a polyamic acid, a polyimide film, and a flexible metal foil laminate using the same, the polyamic acid being obtained by copolymerizing a dianhydride component and a diamine component, the dianhydride component comprising biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), and p-phenylene-trimellitic acid ester dianhydride (TAHQ), and the diamine component comprising at least one diamine component, the diamine component comprising at least one diamine component, the diamine component comprising at least one diamine component, the diamine component comprising at least one diamine component, and at least one diamine component comprising at least one diamine component, the diamine component comprising at least one diamine component, the diamine component comprising at least one diamine component, the diamine component comprising at least one diamine component, and at least one diamine component comprising at least one diamine component. And the diamine com