Multilayer ceramic shell with high board-level reliability and preparation method

• Main Authors: ZHANG HUIXIN, ZHANG HE, LIU YAOYAO, LI NA, LIU YANG, LI HAN, YU FEI, YANG XIN, XIE YUE, YANG HUAN, YANG ZHENTAO, ZHANG QIAN, GUO ZHIWEI, YU XIMENG, CHEN JIANGTAO, DUAN QIANG, LIU LINJIE
• Format: Patent
• Language: Chinese; English
• Published: 02.07.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a multi-layer ceramic shell with high board-level reliability and a preparation method, and belongs to the technical field of ceramic packaging, the multi-layer ceramic shell comprises a ceramic substrate, a bonding pad base plate is arranged on the back surface of the ceramic substrate in an array mode, a copper plating layer, a nickel plating layer and a gold plating layer are sequentially arranged on the surface of the bonding pad base plate to form a bonding pad for welding ball planting, and the bonding pad base plate is provided with a copper plating layer. A solder mask layer is arranged around the bonding pad, and the lower surface of the bonding pad protrudes out of the solder mask layer. According to the multilayer ceramic shell with high board-level reliability provided by the invention, the bonding pad adopts a copper-plated structure, and thermal stress generated in a thermal cycle process in an interconnection structure can be released in time by utilizing the characterist