Manufacturing method of PCB embedded with copper body

• Main Authors: KE BINBIN, XU SHIYU
• Format: Patent
• Language: Chinese; English
• Published: 28.06.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a manufacturing method of a PCB embedded with a copper body. The manufacturing method comprises the following steps that S1, a lower core board with an inner layer circuit pattern is manufactured; s2, a plurality of layers of underlying core plates and middle bonding layers a...