Manufacturing method of PCB embedded with copper body

The invention discloses a manufacturing method of a PCB embedded with a copper body. The manufacturing method comprises the following steps that S1, a lower core board with an inner layer circuit pattern is manufactured; s2, a plurality of layers of underlying core plates and middle bonding layers a...

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Bibliographic Details
Main Authors KE BINBIN, XU SHIYU
Format Patent
LanguageChinese
English
Published 28.06.2024
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Summary:The invention discloses a manufacturing method of a PCB embedded with a copper body. The manufacturing method comprises the following steps that S1, a lower core board with an inner layer circuit pattern is manufactured; s2, a plurality of layers of underlying core plates and middle bonding layers are stacked together in the mode that the middle bonding layers are placed between any two adjacent layers of underlying core plates, and the underlying core plates and the middle bonding layers are fixed together in a press fit mode to form a core plate stacked body; s10, the upper core plate is combined to the lower core plate on the topmost layer of the core plate stacked body through the upper bonding layer, and a base plate is formed; step S11, drilling a component hole in the substrate; and the component hole penetrates through the copper body. According to the method, the manufacturing difficulty of the component hole can be reduced, the problem of knife breakage can be effectively solved, and it can be ensur
Bibliography:Application Number: CN202410401761