Package with low warpage carrier

• Main Authors: CELORIO, EMILIANO, J., B, MAUS, IMRE, LIU, STEPHEN, T, MOHAMMED ABDUL RAHMAN, WANG LEE SHUANG, JEONG CHAN YOUNG
• Format: Patent
• Language: Chinese; English
• Published: 28.06.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of manufacturing a package, where the method includes: providing a carrier having at least one component mounting area for mounting at least one electronic component, where the carrier is pre-warped according to an initial curvature direction; providing at least one electronic component wherein the at least one electronic component comprises at least one first electrode on a first surface and at least one second electrode on a second surface wherein the second surface is opposite the first surface; the at least one electronic component is mounted on the at least one component mounting area with the second surface by a solder structure, and ambient conditions are applied to the carrier and the at least one electronic component during mounting such that the carrier is re-warped, thereby at least partially reducing warpage of the carrier on the mounting plane. 一种制造封装体的方法，其中，所述方法包括：提供具有用于安装至少一个电子构件的至少一个构件安装区域的载体，其中，所述载体根据初始曲率方向被预翘曲；提供至少一个电子构件，其中，所述至少一个电子构件包括在第一表面上的至少一个第一电极和在第二表面上的至少一个第二电极，其中，所述第二表面与所述第一表