Thermal diffusion device

A thermal diffusion device and an electronic apparatus are provided. A vapor chamber (1) according to one embodiment of a heat diffusion device is provided with: a housing (10) having a first inner wall surface (11a) and a second inner wall surface (12a) facing each other in a thickness direction Z;...

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Bibliographic Details
Main Authors NUMOTO TATSUHIRO, MUKAI TSUYOSHI
Format Patent
LanguageChinese
English
Published 25.06.2024
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Summary:A thermal diffusion device and an electronic apparatus are provided. A vapor chamber (1) according to one embodiment of a heat diffusion device is provided with: a housing (10) having a first inner wall surface (11a) and a second inner wall surface (12a) facing each other in a thickness direction Z; a working medium (20) sealed in the internal space of the housing (10); and a core structure (30) disposed in the internal space of the housing (10). The core structure (30) is provided with: a support section (31) that is in contact with the first inner wall surface (11a); and a perforated part (32) which is made of the same material as the supporting part (31) and is integrally formed with the supporting part (31). 提供热扩散器件和电子设备。热扩散器件的一实施方式的均热板(1)具备:壳体(10),其具有在厚度方向Z上相向的第1内壁面(11a)和第2内壁面(12a);工作介质(20),其被封入于壳体(10)的内部空间;以及芯体构造体(30),其配置于壳体(10)的上述内部空间。芯体构造体(30)包括:支承部(31),其与第1内壁面(11a)接触;以及有孔部(32),其由与支承部(31)相同的材料构成,且与支承部(31)一体构成。
Bibliography:Application Number: CN202280074978