POLYIMIDE FILM BONDING METHOD, BONDING DEVICE, AND BONDED STRUCTURE HAVING BONDED POLYIMIDE FILM

• Main Authors: NAGASAKI AKARI, MORIGAKI RYO, KATO YOSUKE, YAMAGUCHI DAISUKE, KAMIMURA RYOTARO, TAKAI KAZUTAKA
• Format: Patent
• Language: Chinese; English
• Published: 25.06.2024
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The polyimide films are bonded to each other by bringing the heat plate into contact with the overlapping portion of the two polyimide films. The heating temperature generated by the contact of the hot plate is more than 450 DEG C, and the contact time of the polyimide film and the hot plate is less than 12 seconds. In addition, the overlapped part of the two polyimide films is irradiated with laser light. The upper surface of the polyimide film is irradiated with laser light while the thermal insulation material is brought into close contact with the lower surface of the overlapped polyimide film. By means of these methods, it is possible to directly bond infusible polyimide films to each other. In addition, by heating the polyimide film in a state in which a pressing force is applied such that one surface of the polyimide film is brought into close contact with the metal surface, it is possible to directly bond the difficult-to-melt polyimide film to the metal. 通过使热板接触两张聚酰亚胺薄膜相重叠的部分，而将聚酰亚胺薄膜彼此接合。因热板的接触而产生的加