Binder composition for molding mold

• Main Authors: KANZAWA SATOSHI, NAKAHATA YU, YAMAYA MITSUHITO
• Format: Patent
• Language: Chinese; English
• Published: 21.06.2024
• Subjects: CASTING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; FOUNDRY MOULDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; POWDER METALLURGY; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The present invention is a binder composition for molding a mold for carbon dioxide curing, the binder composition containing a basic phenolic resin, an oxygen-containing anion compound, and a tertiary amine compound containing a compound selected from the group consisting of N, N, N ', N', N ', N', N ', N', N ', N', N ', N', N '- the solvent is selected from one or more of N, N ', N', N ''-pentamethyldiethylenetriamine, 3, 3-imino bis (N, N-dimethyl propylamine), 6-dimethylamino-1-hexanol, bis (2-morpholinoethyl) ether, 2, 2-dimethylaminoethoxyethanol, 1, 4-diazabicyclo [2.2. 2] octane and triisopropanolamine. According to the present invention, it is possible to provide a binder composition for molding a mold, a composition for molding a mold, and a method for producing a mold, whereby the surface of the mold is prevented from being recessed by a push rod when the mold is removed from the mold. 本发明为一种二氧化碳固化用铸模造型用粘结剂组合物，其含有碱性酚醛树脂、含氧阴离子化合物以及叔胺化合物，所述叔胺化合物包含选自N,N,N',N",N"-五甲基二亚乙基三胺、3,3-亚氨基双(N,N-二甲基丙胺)、6-二甲基氨基-1