Package substrate with conduction columns and manufacturing method thereof

• Main Authors: LAN ZHICHENG, HOU NING, LI BIAO, WANG JIE
• Format: Patent
• Language: Chinese; English
• Published: 18.06.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a manufacturing method of a packaging substrate with a conduction column, and the method comprises the following steps: providing a double-sided copper-clad plate which comprises a first copper foil layer, a stripping layer, a first base material layer and a second copper foil layer which are sequentially stacked in the thickness direction, and arranging a plurality of conduction bodies in a manner of penetrating through the first copper foil layer, the stripping layer and the first base material layer; removing the first copper foil layer and a part of the conducting body higher than the surface of the stripping layer to obtain a conducting column; removing the stripping layer, patterning the second copper foil layer to form a plurality of connecting pads, and obtaining a first substrate; the first substrate is attached to a second substrate, the second substrate comprises a second base material layer, a first circuit layer and a second circuit layer, the first circuit layer and the se