Electronic equipment and preparation method
The invention discloses an electronic device and a preparation method, and the preparation method comprises the steps: obtaining a metal workpiece which comprises a first part and a second part which are used for forming an accommodation space, and forming the second part after a first side of the f...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
14.06.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses an electronic device and a preparation method, and the preparation method comprises the steps: obtaining a metal workpiece which comprises a first part and a second part which are used for forming an accommodation space, and forming the second part after a first side of the first part is subjected to a first preparation process in a first direction; the first part and the second part are stacked in the first direction; the first part is provided with a first containing space used for containing a first element, the second part is provided with a second containing space used for containing a second element, and the first containing space and the second containing space are arranged in a stacked mode in the first direction and communicate with each other.
本申请公开了一种电子设备、制备方法,该制备方法包括:获得金属工件,金属工件包括用于形成容纳空间的第一部分和第二部分,第一部分的第一侧沿第一方向经过第一制备流程后形成第二部分;第一部分与第二部分沿第一方向层叠设置;第一部分具有用于容纳第一元件的第一容纳空间,第二部分具有用于容纳第二元件的第二容纳空间,第一容纳空间与第二容纳空间沿第一方向层叠设置且相连通。 |
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Bibliography: | Application Number: CN202410384419 |