Non-refrigeration measuring device structure and manufacturing method
The invention discloses an uncooled measuring device structure and a manufacturing method thereof. The device structure comprises a microbridge structure established on a substrate; the micro-bridge structure is provided with a bridge floor and supporting columns for supporting the bridge floor, and...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
14.06.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses an uncooled measuring device structure and a manufacturing method thereof. The device structure comprises a microbridge structure established on a substrate; the micro-bridge structure is provided with a bridge floor and supporting columns for supporting the bridge floor, and a heat absorption and thermosensitive composite layer is arranged on the bridge floor; the heat absorption and heat-sensitive composite layer comprises a heat-sensitive layer and a heat absorption and conductive layer which is formed on the heat-sensitive layer in a contact manner; the heat absorption and conductive layer comprises a heat absorption and conduction body formed by a curled conductive one-dimensional quantum material, and ohmic connection is formed between the heat absorption and thermosensitive composite layer and the substrate through the supporting columns. According to the invention, the problems of defects, low light absorption area, low response rate and the like in the preparation of the exist |
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Bibliography: | Application Number: CN202211581539 |