Branch-type multi-channel heat dissipation packaging structure and preparation process thereof

• Main Authors: WU QIBIN, ZHAN ZHIJUN, WU YINGYING, OU XUECHUN, ZHANG WEI, DONG WEI, ZHU ZHONGMING
• Format: Patent
• Language: Chinese; English
• Published: 07.06.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a preparation process of a branch-forked multichannel heat dissipation packaging structure, which comprises the following steps of: taking N metal substrate frames, and printing a first conductive material layer on the upper surface of each metal substrate frame; carrying out first chip mounting on the first conductive material layer; printing a second conductive material layer on the upper surface of the first chip; the same first conductive medium component is mounted on the second conductive material layer on the metal substrate frame, and the first conductive medium component is of a dendritic structure; printing a third conductive material layer on the upper surface of the first conductive medium component right above the A metal substrate frames; a second conductive medium component is mounted on the upper surface of the third conductive material layer; plastic package protection is adopted on the periphery of the internal component, and the end portion of the forked portion of