Low-temperature curing conductive silver paste, preparation method and application

The invention discloses low-temperature curing conductive silver paste, a preparation method and application. The conductive silver paste comprises silver powder conductive filler, an organic carrier solvent, macromolecular resin and an anti-settling additive, wherein the silver powder conductive fi...

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Bibliographic Details
Main Authors CHENG JIARUI, LIU FENG, YI JUNCHAO, WANG YAOYU, RAO SENLIN
Format Patent
LanguageChinese
English
Published 07.06.2024
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRICITY
INSULATORS
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
PRINTING MACHINES OR PRESSES
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:The invention discloses low-temperature curing conductive silver paste, a preparation method and application. The conductive silver paste comprises silver powder conductive filler, an organic carrier solvent, macromolecular resin and an anti-settling additive, wherein the silver powder conductive filler is formed by mixing spherical silver powder with a nanoscale particle size and micron-sized lamellar silver powder with a polarized sheet diameter. The silver powder conductive filler adopts the optimized and adjusted preparation proportion, so that the low-temperature curing performance, the bonding strength and the printability of the conductive silver paste can be synergistically improved. During silk-screen printing, the nano-silver particles in a specific proportion can permeate and fill the stacking gaps of the micron lamellar silver powder, higher average volume resistivity can be obtained, no environmental pollution substance is generated in the whole preparation process, and the large-scale production
Bibliography:Application Number: CN202410306248