Method for selecting shapes of diamond abrasive particles for grinding silicon carbide and related device

• Main Authors: DU ZITAO, WANG XIAORI, TANG ZITAO, LI JUNXUAN, CAI KAIWU, YANG PING, ZHENG CHUNTAO, LI QIUFEN, ZHAO XIUTING
• Format: Patent
• Language: Chinese; English
• Published: 04.06.2024
• Subjects: GRINDING; INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTEDFOR SPECIFIC APPLICATION FIELDS; PERFORMING OPERATIONS; PHYSICS; POLISHING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

The invention discloses a method for selecting the shape of diamond abrasive particles for grinding silicon carbide and a related device, and the damage of the diamond abrasive particles in different shapes to the surface and subsurface of the silicon carbide in the cutting process is analyzed by defining the shape of the diamond abrasive particles in the nanoscale. The friction force, the grinding temperature, the grinding stress and the like in the grinding process are obtained through molecular dynamics calculation, and real-time results which cannot be obtained through experiments are obtained. The damage conditions of the diamond abrasive particles with different shapes to the surface and subsurface of silicon carbide under different exposure heights are analyzed by utilizing a dislocation theory, guidance is provided for grinding of silicon carbide, and meanwhile, a theoretical basis is provided for preparation of a diamond grinding and polishing pad. 本申请公开了一种磨削碳化硅的金刚石磨粒形状选取方法及相关装置，通过在纳米尺度定义金刚石磨粒形状，分析不同