Wafer testing method and wafer probing equipment

The invention discloses a wafer testing method and wafer probe testing equipment. The wafer testing method comprises the following steps: providing a fixed seat; a to-be-tested wafer is placed on the fixing seat, the to-be-tested wafer is provided with a plurality of to-be-tested chip sets, each to-...

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Bibliographic Details
Main Author GUO JIBO
Format Patent
LanguageChinese
English
Published 04.06.2024
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:The invention discloses a wafer testing method and wafer probe testing equipment. The wafer testing method comprises the following steps: providing a fixed seat; a to-be-tested wafer is placed on the fixing seat, the to-be-tested wafer is provided with a plurality of to-be-tested chip sets, each to-be-tested chip set comprises a plurality of columns of chip units arranged in parallel, and each column of chip units comprises a plurality of to-be-tested chips; the invention provides a wafer probing structure, wherein the wafer probing structure is provided with a plurality of test ports; the wafer probing structure is used for testing each chip group to be tested in sequence so as to complete the test of the wafer to be tested; wherein when the wafer probe testing structure is used for testing each to-be-tested chip set, the plurality of testing ports correspond to the plurality of columns of chip units at intervals, and each testing port is used for testing the plurality of to-be-tested chips of each column of
Bibliography:Application Number: CN202410368351