High-precision substrate polishing system

• Main Authors: SHIN INUL, KIM HYUN-OH
• Format: Patent
• Language: Chinese; English
• Published: 31.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

A fixing ring according to one embodiment includes: a core portion formed in a ring shape and including a metal material; and an injection molding portion molded around the core portion to wrap the core portion, the core portion including: a core body formed in a ring shape; and at least one through hole formed through the core body. 根据一实施例的固定环包括：核心部分，其形成为环形，并且包括金属材质；以及注塑部分，其模制形成在核心部分的周围来包裹所述核心部分，所述核心部分包括：核心主体，其形成为环形；以及至少一个通孔，其贯穿所述核心主体形成。