Preparation method of 3D sensor and 3D sensor

The invention provides a preparation method of a 3D sensor and the 3D sensor, and relates to the technical field of sensors, the method comprises the following steps: cutting or etching a substrate to form uniformly arranged triangular pyramid structures, and then forming a hole in the edge of the v...

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Bibliographic Details
Main Authors ZHU XIN, GAO RENFENG
Format Patent
LanguageChinese
English
Published 31.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides a preparation method of a 3D sensor and the 3D sensor, and relates to the technical field of sensors, the method comprises the following steps: cutting or etching a substrate to form uniformly arranged triangular pyramid structures, and then forming a hole in the edge of the vertex angle of each triangular pyramid structure to form a micropore penetrating through the substrate; placing the adhesive film uniformly attached with the sensor chips on the substrate in an aligned manner, heating the substrate to a first heating temperature to soften the adhesive film, vacuumizing through the micropores to enable the adhesive film to extend and be attached to the surface of the triangular pyramid structure, and heating the substrate to a second heating temperature to cure the adhesive film to obtain the sensor chip. And at the moment, the sensor chip is fixed on the surface of the corresponding triangular pyramid structure. Compared with the prior art, the sensor chip can be accurately placed
Bibliography:Application Number: CN202410501710