Curable adhesive composition, film-like adhesive, method for producing multilayer wiring substrate, and multilayer wiring substrate

• Main Authors: ITO YUKA, TAKANO, NOZOMU, IZAWA HIROYUKI, OKOSHI MASASHI, AKAI KUNIHIKO, TAKAGI SHUNSUKE
• Format: Patent
• Language: Chinese; English
• Published: 28.05.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS AS ADHESIVES

Provided is a curable adhesive composition for bonding wiring members constituting a multilayer wiring substrate, the curable adhesive composition satisfying all of the following conditions (A) and (B), where CTE0 (ppm/DEG C) and Tg0 (DEG C) are the coefficient of thermal expansion and the glass transition temperature of a cured product, respectively. (A) 5 < = CTE0 < = 270, (B) 140 < = Tg0 < = 280. 一种固化性黏合剂组合物，其用于黏合构成多层配线基板的配线部件，该固化性黏合剂组合物中，将固化物的热膨胀率及玻璃化转变温度分别设为CTE0(ppm/℃)及Tg0(℃)时，满足下述(A)及(B)的所有条件。(A)5≤CTE0≤270，(B)140≤Tg0≤280。