Preparation of high molecular weight polymers with minimal gel content

• Main Authors: KELLEN, BARBARA, L, WOHL ADAM R, PRINCE, RYAN, B, KUGEL ALEXANDER J
• Format: Patent
• Language: Chinese; English
• Published: 28.05.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

Curable precursor compositions for adhesives (e.g., pressure sensitive adhesives) and related articles, assemblies, and methods are provided. The provided composition contains a mixture comprising 50 to 100 parts by weight of a first polymerizable component, 0 to 50 parts by weight of a second polymerizable component, a transition metal complex soluble in the mixture, and an effective amount of a polymerization initiator, thereby allowing the formation of a high molecular weight polymer substantially free of gel content, the high molecular weight polymer can be readily processed (i.e., a hot melt processable adhesive) by an established hot melt technique even in the absence of a chain transfer agent or a cross-linking agent. 提供了用于粘合剂(例如，压敏粘合剂)的可固化前体组合物以及相关的制品、组件和方法。所提供的组合物含有混合物，该混合物包含50重量份至100重量份的第一可聚合组分、0重量份至50重量份的第二可聚合组分、能够溶于该混合物的过渡金属络合物以及有效量的聚合引发剂，从而允许形成基本上无凝胶含量的高分子量聚合物，该高分子量聚合物甚至在不存在链转移剂或交联剂的情况下，也能够通过已确立的热熔技术容易地加工(即，可热熔加工的粘合剂)。