RESIN MOLDED ARTICLE AND METHOD FOR MANUFACTURING SAME

The invention relates to a resin molded body and a manufacturing method thereof. A resin molded body containing an ethylene-vinyl acetate copolymer resin and carbon black as main components. After the resin molded body is heated from 25 degrees Celsius to 100 degrees Celsius and then cooled to 25 de...

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Bibliographic Details
Main Authors TSUDA KENTO, YANE AKIRA, TANAKA DAISUKE
Format Patent
LanguageChinese
English
Published 28.05.2024
Subjects
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTROGRAPHY
ELECTROPHOTOGRAPHY
HOLOGRAPHY
MAGNETOGRAPHY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PHOTOGRAPHY
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:The invention relates to a resin molded body and a manufacturing method thereof. A resin molded body containing an ethylene-vinyl acetate copolymer resin and carbon black as main components. After the resin molded body is heated from 25 degrees Celsius to 100 degrees Celsius and then cooled to 25 degrees Celsius, the resin molded body at 25 degrees Celsius cooled after being heated to 100 degrees Celsius has a shrinkage rate of 2.0% or less relative to the resin molded body at 25 degrees Celsius before heating. 本发明涉及树脂成形体及其制造方法。一种树脂成形体，其包含乙烯-乙酸乙烯酯共聚物树脂和炭黑作为主要组分。在将所述树脂成形体从25摄氏度加热至100摄氏度、然后冷却至25摄氏度之后，相对于加热前的在25摄氏度下的所述树脂成形体，在加热至100摄氏度之后冷却的在25摄氏度下的所述树脂成形体的收缩率小于或等于2.0％。
Bibliography:Application Number: CN202410144207