Wafer fixing device

• Main Authors: LIN QINGBIAO, HUANG ZONGYOU
• Format: Patent
• Language: Chinese; English
• Published: 21.05.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a wafer fixing device, which comprises a shell and an eccentric rod, and is characterized in that the shell comprises a bearing surface for bearing a wafer, and the bearing surface is provided with a vacuum adsorption port; the shell further comprises at least two bearing arms which are spaced from each other, an adjusting cavity is formed in each bearing arm, the number of the eccentric rods is equal to that of the bearing arms, and each eccentric rod correspondingly extends into one adjusting cavity; the eccentric rod rotates in the adjusting cavity to abut against the inner surface of the adjusting cavity and drive the bearing arms to bend in the vertical direction so as to change the curvature of the bearing face and reduce the gap between the edge of the vacuum adsorption opening and the wafer, and the vacuum adsorption opening adsorbs and fixes the wafer. The wafer fixing device provided by the invention can form good adsorption and holding effects on wafers with different warpi