Substrate processing apparatus
The present disclosure provides a substrate processing apparatus including: a chamber configured to provide a space for processing a substrate; a substrate supporting part configured to support the substrate in the chamber; an upper supply port disposed in an upper portion of the chamber and configu...
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Main Authors | , , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
17.05.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure provides a substrate processing apparatus including: a chamber configured to provide a space for processing a substrate; a substrate supporting part configured to support the substrate in the chamber; an upper supply port disposed in an upper portion of the chamber and configured to supply a supercritical fluid onto an upper surface of the substrate; a recess provided in an upper wall of the chamber and having a diffuser shape having a diameter gradually increasing from an outlet of the upper supply port; and a fluid baffle disposed in the recess between the upper supply port and the substrate, and including cells repeatedly arranged in the space at the same phase and geometric dimension and in fluid communication with each other.
本公开提供了一种基板处理装置,其包括:腔室,被配置成提供用于处理基板的空间;基板支承部,被配置成在腔室中支承基板;上部供应端口,设置在腔室的上部分中,并且被配置成向基板的上表面上供应超临界流体;凹部,设置在腔室的上壁中并且具有扩散器形状,扩散器形状的直径从上部供应端口的出口逐渐增大;以及流体挡板,在凹部中设置在上部供应端口与基板之间,并且包括以相同的相位和几何尺寸重复地布置在空间中并且彼此流体连通的单元格。 |
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Bibliography: | Application Number: CN202311374488 |