Force-heat dual-mode flexible sensor, preparation method and application

• Main Authors: HE SHIXUE, WANG YOUSHAN, WEI QIANDIAO, WU JIAN, SU BENLONG
• Format: Patent
• Language: Chinese; English
• Published: 17.05.2024
• Subjects: ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; PHYSICS; TARIFF METERING APPARATUS; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR

The invention discloses a force and heat dual-mode flexible sensor and a preparation method thereof, and relates to the field of sensors and manufacturing thereof, and the force and heat dual-mode flexible sensor comprises a flexible substrate layer, a sensor layer, a packaging layer and a flexible electrode. The sensor layer is located between the flexible substrate layer and the packaging layer, the flexible electrode is connected with the sensor layer, and the sensor layer is formed by mixing at least one one-dimensional conductive nano material and at least one two-dimensional conductive nano material; the weight part ratio of the one-dimensional conductive nano material to the two-dimensional conductive nano material is 1: (0.5-3). The preparation method comprises the steps of preparing the flexible substrate, preparing the sensing layer on the flexible substrate, fixing the conductive network, preparing the packaging layer and preparing the flexible sensor. The invention has the advantages of high stren