Molybdenum alloy sputtering target material and preparation method thereof

• Main Authors: ZHANG DANHUA, NIU MAN, WANG GUANGDA, JI PENGFEI, WANG FENGQUAN, CHANG YANG
• Format: Patent
• Language: Chinese; English
• Published: 17.05.2024
• Subjects: ALLOYS; CASTING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; FERROUS OR NON-FERROUS ALLOYS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WORKING METALLIC POWDER

The invention provides a molybdenum alloy sputtering target material and a preparation method thereof, and relates to the technical field of refractory metal target materials of flat panel display devices.The preparation method comprises the steps that firstly, element powder is mixed in advance and packaged, and then a treatment method of cold isostatic pressing and hot isostatic pressing is adopted; the molybdenum alloy sputtering target material with fine, uniform and spherical crystal grains is obtained through crystal grain spheroidizing annealing, the sputtering speed is high, the thickness distribution of a sputtering film is uniform, the problems that the outer circle of a large-length-diameter-ratio pipe target is wrinkled or inclined, bent and the like caused by direct hot isostatic pressing can be solved, and the yield of the molybdenum alloy material is increased. 本发明提供了一种钼合金溅射靶材及其制备方法，涉及平面显示装置的难熔金属靶材技术领域，先将各元素粉末分别预先混合，装包套后采用先冷等静压后热等静压的处理方法，通过晶粒球化退火得到晶粒细小、均匀且呈球状的钼合金溅射靶材，溅射速率快，溅射薄膜的厚度分布均匀，还可以消除直接热等