Manufacturing method for tangent connection of bonding PAD and gong groove

• Main Authors: CHEN YANG, KE BINBIN, XU SHIYU
• Format: Patent
• Language: Chinese; English
• Published: 14.05.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to the technical field of PCB production, in particular to a manufacturing method for tangent connection of a bonding PAD and a gong groove. The method comprises the following steps: S1, after an outer-layer circuit of the circuit board is completed, extending a bonding PAD to a milling groove of the circuit board, enabling an extending end of the PAD to extend into the milling groove, and forming a bonding connection area in the milling groove; s2, printing an ink layer in the bonding connection area, covering the bonding PADs in the bonding PAD connection area with the ink layer, filling gaps between adjacent bonding PADs with the ink layer, and then curing the ink layer; s3, the bonding PAD in the bonding PAD connection area is milled away from the ink layer through a milling cutter, and the tail end of the bonding PAD obtained after milling away is connected with the outer edge line of the milling groove in a tangent mode; s4, the ink layer is removed, and the bonded PAD on the circu