Grid structure curing deformation prediction method considering resin settlement under gravity effect

• Main Authors: YE JINRUI, ZHANG BAOZHU, LIU KAI, LIU ZHENDONG
• Format: Patent
• Language: Chinese; English
• Published: 14.05.2024
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTEDFOR SPECIFIC APPLICATION FIELDS; PHYSICS

The invention relates to the technical field of composite materials, in particular to a grid structure curing deformation prediction method considering resin settlement under the action of gravity. According to the method, an overall resin distribution model and a silica gel soft mold boundary acting force model are integrated into a curing deformation prediction model, so that the overall resin distribution of a grid structural member in the curing process and the influence of the adhesive force of a composite material under the action of a silica gel soft mold are fully considered; therefore, the solidification deformation of the grid structural member can be accurately predicted. 本发明涉及复合材料技术领域，特别涉及一种考虑重力作用下树脂沉降的网格结构固化变形预测方法。该方法通过在固化变形预测模型中融入了整体树脂分布模型和硅胶软模边界作用力模型，这充分考虑了网格结构构件在固化过程中整体树脂分布以及硅胶软模作用下复合材料的粘附力的影响，从而可以精确预测网格结构构件的固化变形。