Blanking system of electroplating production line of high-density integrated circuit lead frame

• Main Authors: SU QIAN, LIN YUXIAN, LIN ZHILIN, MENG MIN
• Format: Patent
• Language: Chinese; English
• Published: 14.05.2024
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention relates to the technical field of lead frame blanking, in particular to a blanking system of a high-density integrated circuit lead frame electroplating production line, which comprises a machine table, a main conveying mechanism, an adjustable material receiving box, a sheet lifting mechanism, a material moving hand assembly, a sheet pushing mechanism and a sheet inserting device, compared with the prior art, the efficiency of electric adjustment is higher than that of manual adjustment according to the size of the receiving clip during use, and the adjustment accuracy is improved. And when the lead frames with different widths are transmitted, only the lengths and the widths need to be respectively adjusted once, and the lead frames do not need to be independently adjusted for multiple times. In the aspect of the material receiving mode, the lead frame on the main conveying belt can be sucked/clamped to the material receiving clip in the stacking station on the side through the material moving