Low-dielectric-constant laser-weldable polyamide composite material as well as preparation method and application thereof

• Main Authors: XU HONGJI, CHEN PINGXU, YE NANBIAO, WU CHANGBO, ZHENG YIQUAN, ZHOU CHENXU, DING CHAO, JIANG XI, ZHOU HUALONG
• Format: Patent
• Language: Chinese; English
• Published: 14.05.2024
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention discloses a low-dielectric-constant laser-weldable polyamide composite material as well as a preparation method and application thereof. The polyamide composite material comprises the following components in parts by weight: 30-50 parts of polyamide resin, 10-20 parts of polypropylene resin, 2-5 parts of a compatilizer, 10-25 parts of hollow glass beads, 0.1-0.5 part of a stabilizer and 1-2 parts of a laser transmission improver, and the particle size D50 of the hollow glass beads is 15-35 [mu] m. The polyamide composite material disclosed by the invention can keep relatively high rigidity while having low dielectric constant and high laser transmittance. 本发明公开了一种低介电常数可激光焊接的聚酰胺复合材料及其制备方法和应用。所述聚酰胺复合材料，以重量份计，包括如下组分：聚酰胺树脂30-50份，聚丙烯树脂10-20份，相容剂2-5份，空心玻璃微珠10-25份，稳定剂0.1-0.5份，透激光改善剂1-2份，其中，所述空心玻璃微珠的粒径D50为15-35μm。本发明的聚酰胺复合材料在兼顾介电常数低且具有高激光透过率的同时可以保持较高的刚性。